Suclink is a manufacturer specializing in IC substrates and high-difficulty, special-process printed circuit boards.
Introduce advanced substrate processing technologies such as MSAP, ETS and SAP to meet the substrate requirements for packaging of RF module chips, memory chips, application processor chips and high-performance computing chips.
In the traditional FR4 field, layers from 2L to 62L, including high-step HDI to anylayer HDI.High-difficulty PCB (high multi-layer boards with 8-62 layers, high-frequency/speed, rigid-flex boards, heavy copper boards, etc.); special process PCB (multi-layered hybrid, deep micro-holes, stepped gold fingers, long and short gold fingers, copper paste plugged holes, POFV, back drilling, semi-holes, metal edge coating, mechanical blind holes, controlled-depth drilling/blind chiseling, local thick copper, etc.) have extensive product experience and technical accumulation.
The product is widely applied in the following fields: semiconductor chips, artificial intelligence, communication equipment, industrial control, automotive electronics, medical electronics, consumer electronics, LED, etc.
Based on the core business of PCB manufacturing, Suclink has integrated upstream and downstream resources and can provide one-stop services including PCB design—PCB manufacturing—SMT. This helps shorten the production cycle for customers, reduce production costs, and enhance the efficiency of product development.
