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IC Carrier Board
Rigid-Flex Capability
| Capability for flex-rigid board | |||||
| Items | 2026 | 2027 | |||
| Sample | Mass production | Sample | Mass production | ||
| Thickness of flex board(mm) | 0.025~0.15 | 0.025~0.1 | 0.025~0.15 | 0.025~0.1 | |
| Surface flatness (mm) | 50 | 50 | 30 | 50 | |
| Min hole to window distance(mm) | 0.5 | 0.8 | 0.4 | 0.5 | |
| Copper to window distance (mm) | 0.2 | 0.4 | 0.2 | 0.4 | |
| Resin in prepreg flow to window(mm) | 0.5 | 1.0 | 0.5 | 0.5 | |
| Min window width(mm) | 3.0 | 3.5 | 3.0 | 3.5 | |
| Finished copper thickness of flex board (oz) | 1/2-2 | 1/2-2 | 1/2-2 | 1/2-2 | |
| Finished copper thickness of rigid board (oz) | 1/3-4 | 1/2-4 | 1/3-4 | 1/3-4 | |
| Min trace width/spacing (mm) | 0.06/0.06 | 0.075/0.075 | 0.05/0.05 | 0.06/0.06 | |
| Min board thickness (mm) | 0.35 | 0.4 | 0.35 | 0.4 | |
| Impedance control (%) | ±10 | ±10 | ±8 | ±10 | |
| Bow and twist (%) | ≤0.5 | ≤0.75 | ≤0.5 | ≤0.75 | |
| Min PTH hole size(mm) | 0.1 | 0.15 | 0.1 | 0.15 | |
| Tolerance for control depth routing (mm) | ±0.075 | ±0.075 | ±0.075 | ±0.075 | |
| Laser layer count | 3 | 2 | 3 | 3 | |
| Flex layer in board count (hinge type ) | ≤6 | ≤4 | ≤6 | ≤4 | |
| flex layer in board count (adhesive together) | ≤2 | ≤2 | ≤2 | ≤2 | |
| Capability for FPC | ||
| Items | Standard | Special |
| Layer count | 1-8 | 10 |
| Max panel size | 250*450mm | NA |
| Min panel size | 10*15mm | NA |
| Max board thickness/Min board thickness | 0.75/0.05mm | NA |
| Board thickness tolerance(0.1mm≤board thickness﹤0.4mm) | ±0.03mm | ±0.02mm |
| Max drill aperture/Min drill aperture | 6.4mm/0.04mm | NA |
| Min green oil bridge | 0.2mm | NA |
| Max base copper thickness/Min base copper thickness | 35um/6um | NA |
| Max dielectric thickness/Min dielectric thickness | 50um/12um | NA |
| Stiffener material | PI/FR4/metal | NA |
| Tooling tolerance | ±0.03mm | ±0.02mm |
| Via(Laser) tolerance | ±0.025mm | NA |
| Hole site tolerance | ±0.05mm | NA |
| Min line width / line space | 40um/40um | 35um/35um |
| Etch tolerance | ±0.02mm | ±0.015mm |
| Min SM thickness | 10um | NA |
| Max punch panel size | 250mm*200mm | NA |
| Outline tolerance | ±0.1mm | ±0.05mm |
| Tolerance of hole to outline | ±0.1mm | ±0.07mm |
| Thermal Stressing | 288±5℃，10s，3times | |
| Surface treatment | G / F gold，ENIG，OSP | |