Technology
Technology Center
IC Carrier Board
FR4 Capability
| Capability for high multilayer board | |||||
| Items | 2026 | 2027 | |||
| Sample | Mass production | Sample | Mass production | ||
| Layers | 52 | 50 | 62 | 60 | |
| Max board thickness(mm) | 10 | 8 | 10 | 10 | |
| Min board thickness(mm) | 0.5 | 0.5 | 0.5 | 0.5 | |
| Panel size(mm) | 620*1200 | 620*920 | 620*1200 | 620*1200 | |
| Min/max base copper thickness(oz) | Hoz/6oz | Hoz/6oz | Hoz/6oz | Hoz/6oz | |
| Min core thickness(um) | 50 | 50 | 50 | 50 | |
| Min line width / line space of inner layer(um) | 66/76 | 76/76 | 66/76 | 76/76 | |
| Min line width / line space of outer layer(um) | 76/76 | 76/76 | 76/76 | 76/76 | |
| Min copper pad size(mm) | 0.35 | 0.35 | 0.35 | 0.35 | |
| Min BGA center distance(mm) | 0.4 | 0.5 | 0.4 | 0.5 | |
| Drill hole | Mechanical min aperture(mm) | 0.15 | 0.15 | 0.15 | 0.15 |
| Laser min aperture(mm) | 0.1 | 0.1 | 0.075 | 0.1 | |
| Min crimping hole tolerance(mm) | ±0.05 | ±0.05 | ±0.05 | ±0.05 | |
| Back drilling to copper(mm) | 0.11 | 0.125 | 0.11 | 0.125 | |
| Back drill stub(mm) | 0.125±0.075 | 0.15±0.1 | 0.125±0.075 | 0.15±0.1 | |
| Thickness diameter ratio | Mechanical drilling hole diameter 0.15mm | 20:1 | 16:1 | 20:1 | 16:1 |
| Mechanical drilling hole diameter 0.2mm | 23:1 | 20:1 | 23:1 | 20:1 | |
| Impedance tolerance | Inner | ±5% | ±8% | ±5% | ±8% |
| Outer | ±8% | ±10% | ±8% | ±9% | |
| Resin plug hole (vacuum) | Min plug hole diameter(mm) | 0.15 | 0.2 | 0.15 | 0.2 |
| Max thickness diameter ratio with aperture of 0.2mm | 14:1 | 12:1 | 14:1 | 12:1 | |
| Resistance welding | Green oil counterpoint(um) | ±25 | ±35 | ±25 | ±35 |
| Min green oil bridge(mm) | 0.064 | 0.075 | 0.05 | 0.075 | |
| Thickness diameter ratio of resistance welding plug hole | 14:1 | 12:1 | 14:1 | 12:1 | |
| Plate warpage control % | ≤0.5% | ≤0.5% | ≤0.3% | ≤0.5% | |
| Surface treatment | ENIG，OSP，HAL-LF，Gold， gold OSP，Tin，G/ F OSP， G / F gold | ||||