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5G communication High Speed Products22L
5G communication High Speed Products22L
▪ 22 Layer PCB▪ High Speed Low Loss▪ 2 Lam-L22-3 and L1-22▪ 11 Sets of Back Drill,VIPPO▪ 20 T-Coins 22-3/3-1▪ 10 set of CI Single/Diff▪ HVLP Copper
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High frequency antennaboard2L
High frequency antennaboard2L
▪ Layer count--2L▪ Material--Doosan DS-7409DV Low Loss▪ Board thickness --0.6±0.6mm▪ Min.LW/LS--0.580mm±5%▪ Min.Drill Size --0.2mm▪ Surface Finish --Immersion tin
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High Speed PCB26L
High Speed PCB26L
▪ Layer count-26L▪ Material -Tachyon 100G▪ Board Thickness --3.5±0.35mm▪ Copper thickness --0.33OZ▪ Min.LW/LS-0.118/0.051mm.Min▪ hole Size --0.225mm▪ Surface Finish --ENIG▪ Application field-Industrial Control
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