High End HDI Board-Shenzhen Suclink Technology Co.,Ltd

High Multilayer Board26L

26LHigh Multilayer Board

Layers:26LMatrerials:Tachyon 100GThickness:3.5±0.35mmInner copper:0.330ZMin line width/space:0.112/0.05mmMin aperture:0.225mmSurface treatment:ENIGApplication: Switch

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High End HDI Board2+20+2HDI

2+20+2HDIHigh End HDI Board

▪ Layers: 24L▪ Materials: FR-4(Tg180)VT-47▪ Thicknes: 2.59+/-0.26mm▪ Min line width/spacing: 3.5/5.0mil▪ Min aperture:0.25mm▪ Surface treament: ENIG

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Heavy Copper10L

10LHeavy Copper

.Layer count: 10L.Material: EM-827.Board thickness:4.85mm.Copper thickness on all layers:3 oz(RTF)·Min.LW/LS: 0.45/0.30mm·Min.Drill Size:0.25mm·Surface Finish:ENIG

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High Multilayer Board10L

10LHigh Multilayer Board

▪ Layers: 10L▪ P/N: 400Gbps QSFP-DD▪ Material: M6(R-5775)▪ Thickness tolerance: goldfinger1.0±0.075mm▪ Plug shape tolerance: ±0.05mm▪ Surface treatment: ENEPIG+Hard gold finger

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High End HDI Board3+10+3HD1

3+10+3HD1High End HDI Board

▪ Layers -- 16Layer ▪ Material -- PanasonicR-5775 ▪ Thickness --2mm ▪ Inner copper -- HOZ ▪ Min line width/spacing -- 2/2mil ▪ Min Aperture --0.1mm ▪ Surface Treament- ENIG ▪ Application --Communication Equipmet

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High End HDI Board12L Anylayer

12L AnylayerHigh End HDI Board

▪ Layers:12L ▪ Board thickness:0.8mm ▪ Material:EM-370 ▪ Min Width/Spacing:60/60um ▪ Surface treament:ENIG+OSP

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Heavy Copper10L

10LHeavy Copper

.Industrial control systems.Layer count: 10L.Material: EM370(Z).Board thickness:2.48mm.Copper thickness :4 oz(RTF).Min.LW/LS:0.433/0.137mm.Min. Drill Size : 0.3mm.Surface Finish:ENIG

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Heavy Copper10L

10LHeavy Copper

.Layer count: 10L.Material:TU865.Board Thickness:3.5mm.Copper thickness:50Z-Min.LW/LS:2/2mm-Min.hole Size :0.7mm.Surface Finish:ENIG.Application field:Communication

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High End HDI Board