What is the appropriate thickness for gold deposition on circuit boards

Introduction to the thickness of gold deposition on circuit boards

1、 Introduction to the gold deposition process for circuit boards

Electrolytic Gold Deposition refers to the process of depositing uniform metal produced by electrolysis onto the surface of a board, and using organic protective agents to make the coating complete and the surface smooth.

The immersion gold process is a protective gold plating process that has good welding reliability, corrosion resistance, and electrical performance. The color of the gold-plated layer is golden yellow, with a gorgeous appearance, commonly used in high demand communication equipment, computer motherboards, and other occasions.

2、 Introduction to the thickness of gold deposition on circuit boards

The immersion thickness refers to the thickness of the gold plating layer, which directly affects the performance of the immersion layer. Generally speaking, the thickness of gold deposition is between 0.03 and 0.125um.

Excessive thickness of gold deposition can cause metal looseness, resulting in insufficient strength or blackening of solder joints. If the gold deposition layer is too thin, it cannot meet some high demand applications.

3、 Precautions for choosing the thickness of the gold deposit

1. Taking into account the actual application environment, determine the thickness of the gold deposit according to actual needs.

2. Different gold deposition processes have different applicable gold deposition thicknesses.

If the circuit board is extended extensively, the thickness of the gold deposition layer should not be too thick, otherwise it will cause unevenness in the circuit.

4. Ensuring the uniformity and integrity of the gold deposition layer is an important factor in ensuring its performance.

IV. Summary

The gold deposition process is a commonly used PCB surface treatment technique, with a gold deposition layer thickness ranging from 0.03 to 0.125um. The selection of suitable immersion thickness should be considered based on actual needs. When conducting the gold deposition process, it is important to ensure that the gold deposition layer is uniform and complete.