What are the performance and technical requirements for circuit boards

The performance and technical requirements of circuit boards mainly include the following core elements:

Performance Requirements

High reliability: Long term stable operation is required in extreme environments such as high temperature, low temperature, high humidity, and vibration. Material selection and manufacturing processes must meet extremely high standards.

Heat dissipation performance: Effective heat conduction is required during high load operation to avoid overheating of components.

Electromagnetic shielding: prevents electromagnetic interference from affecting external devices while protecting internal information from leakage.

Mechanical strength: able to withstand physical stresses such as vibration and impact, ensuring long-term use without deformation.

Durability: Adapt to complex environments and extend service life.

Technical Requirements

Material selection: The substrate material should have high mechanical strength, heat resistance (such as FR-4 glass fiber substrate), and low thermal expansion coefficient (such as PTFE, LCP material).

Process standards:

Dimensional accuracy: Board edge width ≥ 50mm, length ≥ 50mm, curvature ≤ 1.2mm (upward) or 0.5mm (downward).

Surface treatment: The flatness of the solder mask layer affects the accuracy of component mounting, and the roughness needs to be controlled within a reasonable range.

Processing accuracy: Laser drilling technology enhances high-density interconnection capability, and multi-layer design needs to balance signal transmission and anti-interference ability.

Testing and verification: including environmental adaptability tests such as cold and hot cycles, vibration, and drops, as well as electrical performance verification such as high-frequency and electrostatic discharge.

Design principle: Adhere to the 3W principle (line spacing ≥ 3 times line width), and plan the ground wire circuit reasonably to suppress interference.

Application scenarios

Military/aerospace industry: requires high confidentiality, radiation resistance, and extreme environmental adaptability.

Automotive electronics: requires salt spray testing and wet heat aging testing to adapt to a temperature range of -40 ° C to 125 ° C.

Communication/New Energy: High frequency and high-speed technology uses materials such as PTFE to improve signal transmission efficiency.